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 MC74HC138A 1-of-8 Decoder/ Demultiplexer
High-Performance Silicon-Gate CMOS
The MC74HC138A is identical in pinout to the LS138. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. The HC138A decodes a three-bit Address to one-of-eight active-low outputs. This device features three Chip Select inputs, two active-low and one active-high to facilitate the demultiplexing, cascading, and chip-selecting functions. The demultiplexing function is accomplished by using the Address inputs to select the desired device output; one of the Chip Selects is used as a data input while the other Chip Selects are held in their active states. * Output Drive Capability: 10 LSTTL Loads * Outputs Directly Interface to CMOS, NMOS and TTL * Operating Voltage Range: 2.0 to 6.0 V * Low Input Current: 1.0 A * High Noise Immunity Characteristic of CMOS Devices * In Compliance with the Requirements Defined by JEDEC Standard No. 7A * Chip Complexity: 100 FETs or 29 Equivalent Gates
LOGIC DIAGRAM
A0 ADDRESS INPUTS A1 A2 1 2 3 15 Y0 14 Y1 13 Y2 12 Y3 11 Y4 10 Y5 9 Y6 7 Y7 A WL YY WW ACTIVE-LOW OUTPUTS = Assembly Location = Wafer Lot = Year = Work Week
http://onsemi.com MARKING DIAGRAMS
16
16 1
PDIP-16 N SUFFIX CASE 648
MC74HC138AN AWLYYWW 1 16
16 1
SO-16 D SUFFIX CASE 751B 1
HC138A AWLYWW
16 TSSOP-16 DT SUFFIX CASE 948F 1 HC 138A ALYW
16 1
PIN ASSIGNMENT
A0 A1 A2 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC Y0 Y1 Y2 Y3 Y4 Y5 Y6
CHIP- SELECT INPUTS
CS1 CS2 CS3
6 4 5 PIN 16 = VCC PIN 8 = GND
CS2 CS3 CS1
FUNCTION TABLE
Inputs X X L H H H H H H H H X H X L L L L L L L L H X X L L L L L L L L X X X L L L L H H H H X X X L L H H L L H H X X X L H L H L H L H H H H L H H H H H H H H H H H L H H H H H H H H H H H L H H H H H Outputs H H H H H H L H H H H H H H H H H H L H H H H H H H H H H H L H H H H H H H H H H H L H H H H H H H H H H H L CS1CS2 CS3 A2 A1 A0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7
Y7 GND
ORDERING INFORMATION
Device MC74HC138AN MC74HC138AD MC74HC138ADR2 MC74HC138ADT MC74HC138ADTR2 Package PDIP-16 SOIC-16 SOIC-16 TSSOP-16 TSSOP-16 Shipping 2000 / Box 48 / Rail 2500 / Reel 96 / Rail 2500 / Reel
H = high level (steady state); L = low level (steady state); X = don't care
(c) Semiconductor Components Industries, LLC, 2000
1
March, 2000 - Rev. 7
Publication Order Number: MC74HC138A/D
MC74HC138A
IIIIIIIIIIIIIIIIIIIIII I II I I I I I IIIIIIIIIIII II III I I I I I II I I I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I III I I I I I II I I II I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I III I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I II I I I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIII I II I I I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIII I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIII III I II I I IIIIIIIIIIIIIIIIIIIII I IIII II IIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII II I IIII I II I I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII II I II I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII II I
IIIIIIIIIIIIIIIIIIII II I IIII II I I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIII I II II I I I IIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIII II I II I I III II I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII II III II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII
MAXIMUM RATINGS*
Symbol VCC Vin Parameter Value Unit V V V DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) - 0.5 to + 7.0 - 0.5 to VCC + 0.5 - 0.5 to VCC + 0.5 20 25 50 750 500 450 Vout Iin DC Output Voltage (Referenced to GND) DC Input Current, per Pin mA mA mA Iout DC Output Current, per Pin ICC PD DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP SOIC Package TSSOP Package mW Tstg TL Storage Temperature - 65 to + 150 260
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
v
v
_C _C
Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP, SOIC or TSSOP Package)
*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C SOIC Package: - 7 mW/_C from 65_ to 125_C TSSOP Package: - 6.1 .W/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol VCC Parameter
Min 2.0 0
Max 6.0
Unit V V
DC Supply Voltage (Referenced to GND)
Vin, Vout TA
DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 2)
VCC
- 55 0 0 0
+ 125 1000 500 400
_C
ns
tr, tf
VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol VIH
Parameter
Test Conditions
VCC V 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 4.5 6.0 3.0 4.5 6.0
-55_C to 25_C 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9
v 85_C v 125_C
1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9
Unit V
Minimum High-Level Input Voltage
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
v v
VIL
Maximum Low-Level Input Voltage
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
V
VOH
Minimum High-Level Output Voltage
Vin = VIH or VIL |Iout| 20 A
v
V
Vin = VIH or VIL |Iout| |Iout| |Iout|
v 2.4 mA v 4.0 mA v 5.2 mA
2.48 3.98 5.48
2.34 3.84 5.34
2.20 3.70 5.20
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MC74HC138A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
III I I I I I II I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I II I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIII IIII II II I I I I III I I I I I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I III I I I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I
Guaranteed Limit Symbol VOL Parameter Test Conditions VCC V 2.0 4.5 6.0 3.0 4.5 6.0 6.0 6.0 -55_C to 25_C 0.1 0.1 0.1
v 85_C v 125_C
0.1 0.1 0.1 0.1 0.1 0.1 0.33 0.33 0.33 0.40 0.40 0.40
Unit V
Maximum Low-Level Output Voltage
Vin = VIH or VIL |Iout| 20 A
v
Vin = VIH or VIL |Iout| |Iout| |Iout| Vin = VCC or GND Vin = VCC or GND Iout = 0 A
v 2.4 mA v 4.0 mA v 5.2 mA
0.26 0.26 0.26
Iin
Maximum Input Leakage Current
0.1 4
1.0 40
1.0 160
A A
ICC
Maximum Quiescent Supply Current (per Package)
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D).
II I III I I I I I II I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I II I I III II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I II I I II II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I III II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I II I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I
Guaranteed Limit Symbol tPLH, tPHL Parameter VCC V 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 -- -55_C to 25_C 135 90 27 23 110 85 22 19
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6.0 ns)
v 85_C v 125_C
170 125 34 29 140 100 28 24 150 120 30 26 95 40 19 16 10 205 165 41 35 165 125 33 28 180 150 36 31 110 55 22 19 10
Unit ns
Maximum Propagation Delay, Input A to Output Y (Figures 1 and 4)
tPLH, tPHL
Maximum Propagation Delay, CS1 to Output Y (Figures 2 and 4)
ns
tPLH, tPHL
Maximum Propagation Delay, CS2 or CS3 to Output Y (Figures 3 and 4)
120 90 24 20 75 30 15 13 10
ns
tTLH, tTHL
Maximum Output Transition Time, Any Output (Figures 2 and 4)
ns
Cin
Maximum Input Capacitance
pF
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D). Typical @ 25C, VCC = 5.0 V 55
CPD
Power Dissipation Capacitance (Per Package)*
pF
* Used to determine the no-load dynamic power consumption: P D = C PD V CC 2 f + I CC V CC . For load considerations, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D).
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3
MC74HC138A
SWITCHING WAVEFORMS
VALID INPUT A tPLH OUTPUT Y 50% 50% tPHL OUTPUT Y tTHL VALID VCC GND INPUT CS1 tPHL 90% 50% 10% tTLH 90% 50% 10% tPLH tr tf VCC GND
Figure 1.
Figure 2.
TEST POINT tf INPUT CS2, CS3 90% 50% 10% tPHL OUTPUT Y 90% 50% 10% tTHL tTLH *Includes all probe and jig capacitance tPLH tr VCC GND DEVICE UNDER TEST OUTPUT
CL*
Figure 3.
Figure 4. Test Circuit
PIN DESCRIPTIONS
ADDRESS INPUTS A0, A1, A2 (Pins 1, 2, 3)
Address inputs. For any other combination of CS1, CS2, and CS3, the outputs are at a logic high.
OUTPUTS Y0 - Y7 (Pins 15, 14, 13, 12, 11, 10, 9, 7)
Address inputs. These inputs, when the chip is selected, determine which of the eight outputs is active-low.
CONTROL INPUTS CS1, CS2, CS3 (Pins 6, 4, 5)
Chip select inputs. For CS1 at a high level and CS2, CS3 at a low level, the chip is selected and the outputs follow the
Active-low Decoded outputs. These outputs assume a low level when addressed and the chip is selected. These outputs remain high when not addressed or the chip is not selected.
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MC74HC138A
EXPANDED LOGIC DIAGRAM
15
Y0
14
Y1
A0
1
13
Y2
A1
2
12
Y3
11 A2 3 10 CS3 CS2 5 4 9
Y4
Y5
Y6
7
Y7
CS1
6
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5
MC74HC138A
PACKAGE DIMENSIONS
PDIP-16 N SUFFIX CASE 648-08 ISSUE R
-A -
16 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MILLIMETERS MIN MAX MIN MAX 0.740 0.770 18.80 19.55 0.250 0.270 6.85 6.35 0.145 0.175 4.44 3.69 0.015 0.021 0.53 0.39 0.040 0.070 1.77 1.02 0.100 BSC 2.54 BSC 0.050 BSC 1.27 BSC 0.008 0.015 0.38 0.21 0.110 0.130 3.30 2.80 0.295 0.305 7.74 7.50 10 0 10 0 0.020 0.040 1.01 0.51
B
1 8
F S
C
L
-T - H G D 16 PL 0.25 (0.010)
M
SEATING PLANE
K
J TA
M
M
SOIC-16 D SUFFIX CASE 751B-05 ISSUE J
-A -
16 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 4.00 3.80 1.75 1.35 0.49 0.35 1.25 0.40 1.27 BSC 0.25 0.19 0.25 0.10 7 0 6.20 5.80 0.50 0.25 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.229 0.244 0.010 0.019
-B -
1 8
P 8 PL 0.25 (0.010)
M
B
M
G F
K C -T SEATING -
PLANE
R X 45
M D 16 PL 0.25 (0.010)
M
J
T
B
S
A
S
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MC74HC138A
PACKAGE DIMENSIONS
TSSOP-16 DT SUFFIX CASE 948F-01 ISSUE O
16X K REF
0.10 (0.004) 0.15 (0.006) T U
S
M
TU
S
V
S
K K1
16
2X
L/2
9
J1 B -U-
L
PIN 1 IDENT. 1 8
SECTION N-N
J
N 0.25 (0.010) 0.15 (0.006) T U
S
A -V- N F DETAIL E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_
C 0.10 (0.004) -T- SEATING
PLANE
H D G
DETAIL E
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7
EEE CCC EEE CCC
M
-W-
DIM A B C D F G H J J1 K K1 L M
MC74HC138A
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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MC74HC138A/D


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